SEOUL, South Korea / RankWire.AI / – Samsung Electronics has introduced innovative memory and storage technology plans aimed at enhancing artificial intelligence infrastructure. These developments were announced at the 2026 OCP Global Summit in San Jose, California, from October 12 to 15. The company’s roadmap emphasizes high-performance memory, expanding memory capacity through Compute Express Link, and next-generation solid-state drives. Additionally, Samsung will collaborate with AMD on a joint CXL demonstration. The initiatives target overcoming the capacity limitations faced by current AI servers.
Samsung outlined its approach through three primary objectives: increasing speed, enabling memory scalability, and ensuring data persistence. To improve speed, the company showcased custom high-bandwidth memory along with HBM5, the eighth iteration of the technology. For scalability, it promoted CXL as a solution to extend memory beyond what is installed within each server. To address data persistence, Samsung introduced advanced SSD-based storage and management systems. The company also demonstrated storage software designed to optimize data processing efficiency in AI applications.
According to Samsung, the rising deployment of AI agents necessitates greater memory during inference processes. Larger models generate more data when providing responses, and this data must remain accessible to processors. Traditional systems restrict the amount of memory each processor can access. Samsung presented CXL technology as an effective method to surpass these limitations. The company also highlighted key-value cache optimization techniques that allow AI models to reuse previously processed data instead of repeating the same computations.
Partnership with AMD Expands to CXL Memory Expansion
A joint demonstration between Samsung and AMD will showcase a CXL-based solution designed to increase memory capacity in AI systems. This technology enables processors to share memory resources instead of relying solely on local server memory. Samsung reports that engineers have validated this solution within real system environments. The demonstration is an extension of the memorandum of understanding signed by both companies in March 2026, focusing on next-generation AI memory and computing. On October 7, AMD CEO Lisa Su visited Korea and met with Jeon Young-hyun, Vice Chairman of Samsung’s Device Solutions division.
Memory pooling was another highlight of Samsung’s display. The company demonstrated CMM-D, a CXL-based DRAM module capable of connecting multiple memory units into a single shared pool. This setup allows systems to draw capacity from the pool when workload demands increase. Samsung also showcased processing-in-memory technology, which performs certain calculations within memory chips to reduce data movement and conserve energy. The exhibits included 2-nanometer gate-all-around wafers, Groq LPU wafers, and Nvidia’s Groq 3 LPX system.
Early Co-Design Efforts Shape Samsung’s AI Memory Development Roadmap
Shim Ho-jun, Samsung’s Corporate Vice President and Head of the Application Engineering Team, provided insights into the company’s plans during an executive session. He emphasized that the increasing size of AI models and higher inference demands make expanded memory capacity and bandwidth crucial for achieving optimal system performance. Shim also noted that Samsung is intensifying co-design and technical validation collaborations with global partners from the earliest stages of development. The goal is to better align memory and storage products with customer system designs.
Samsung’s MAX Lab offers customers a platform to evaluate memory and storage solutions under real-world AI workloads. The lab also facilitates co-design tailored to specific system configurations, allowing clients to test pre-commercial technologies like PIM and next-generation SSDs before they are launched commercially. Samsung participated in the summit as a Diamond Sponsor. This event follows its appearances in 2026 at Nvidia GTC, COMPUTEX, and the Future of Memory and Storage conference, reflecting the company’s expanding focus on AI memory solutions.